| Materials for Advanced Packaging |  | Creators: Daniel Lu, C.P. Wong
Publisher: Springer
Category: Book
List Price: $129.00
Buy New: $96.72
as of 5/23/2012 10:06 CDT details
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New (13) Used (5) from $96.72
Seller: oddesseyy
Sales Rank: 906,856
Media: Paperback
Edition: Softcover reprint of hardcover 1st ed. 2009
Pages: 736
Number Of Items: 1
Shipping Weight (lbs): 2.2
Dimensions (in): 6.1 x 9.2 x 1.5
ISBN: 144194611X
Dewey Decimal Number: 620
EAN: 9781441946119
ASIN: 144194611X
Publication Date: November 4, 2010
Availability: Usually ships in 1-2 business days
Condition: BRAND NEW ITEM.INTERNATIONAL SHIPPING AVAILABLE. No Expedited Shipping
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Product Description
Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.
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Copyright © 2009 Fundacion Tarija Digital
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